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TJF1051
High-speed CAN transceiver
Rev. 01 -- 10 August 2010 Product data sheet
1. General description
The TJF1051 is a high-speed CAN transceiver that provides an interface between a Controller Area Network (CAN) protocol controller and the physical two-wire CAN bus. The transceiver is designed for high-speed (up to 1 Mbit/s) CAN industrial applications, providing differential transmit and receive capability to (a microcontroller with) a CAN protocol controller. The TJF1051 is a step up from the TJA1050 high-speed CAN transceiver. It offers improved ElectroMagnetic Compatibility (EMC) and ElectroStatic Discharge (ESD) performance, and also features ideal passive behavior to the CAN bus when the supply voltage is off. The TJF1051 can be interfaced directly to microcontrollers with supply voltages from 3 V to 5 V These features make the TJF1051 an excellent choice for all types of HS-CAN networks, in nodes that do not require a standby mode with wake-up capability via the bus.
2. Features and benefits
2.1 General
Fully ISO 11898-2 compliant Low ElectroMagnetic Emission (EME) and high ElectroMagnetic Immunity (EMI) VIO input allows for direct interfacing with 3 V to 5 V microcontrollers
2.2 Low-power management
Functional behavior predictable under all supply conditions Transceiver disengages from the bus when not powered up (zero load)
2.3 Protection
High ESD handling capability on the bus pins Transmit Data (TXD) dominant time-out function Undervoltage detection on pins VCC and VIO Thermally protected
NXP Semiconductors
TJF1051
High-speed CAN transceiver
3. Ordering information
Table 1. Ordering information Package Name TJF1051T/3 SO8 Description plastic small outline package; 8 leads; body width 3.9 mm Version SOT96-1 Type number
4. Block diagram
VIO 5 VCC 3 VCC
TJF1051
TEMPERATURE PROTECTION VIO SLOPE CONTROL AND DRIVER 7 CANH
TXD
1
TIME-OUT
6
CANL
S
8
MODE CONTROL
RXD
4
DRIVER
2 GND
015aaa099
Fig 1.
Block diagram
TJF1051
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5. Pinning information
5.1 Pinning
TJF1051T/3
TXD GND VCC RXD 1 2 3 4
015aaa100
8 7 6 5
S CANH CANL VIO
Fig 2.
Pin configuration diagram
5.2 Pin description
Table 2. Symbol TXD GND VCC RXD VIO CANL CANH S Pin description Pin 1 2 3 4 5 6 7 8 Description transmit data input ground supply supply voltage receive data output; reads out data from the bus lines supply voltage for I/O level adapter LOW-level CAN bus line HIGH-level CAN bus line Silent mode control input
TJF1051
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TJF1051
High-speed CAN transceiver
6. Functional description
The TJF1051 is a stand-alone high-speed CAN transceiver with Silent mode. It combines the functionality of the TJA1050 transceiver with improved EMC and ESD handling capability. Improved slope control and high DC handling capability on the bus pins provides additional application flexibility.
6.1 Operating modes
The TJF1051 supports two operating modes, Normal and Silent, which are selectable via pin S. See Table 3 for a description of the operating modes under normal supply conditions.
Table 3. Mode Normal Silent
[1] [2]
Operating modes Inputs Pin S LOW LOW HIGH Pin TXD LOW HIGH X[2] Outputs CAN driver dominant recessive recessive Pin RXD active[1] active[1] active[1]
LOW if the CAN bus is dominant, HIGH if the CAN bus is recessive. X = don't care.
6.1.1 Normal mode
A LOW level on pin S selects Normal mode. In this mode, the transceiver is able to transmit and receive data via the bus lines CANH and CANL (see Figure 1 for the block diagram). The differential receiver converts the analog data on the bus lines into digital data which is output to pin RXD. The slope of the output signals on the bus lines is controlled and optimized in a way that guarantees the lowest possible EME levels.
6.1.2 Silent mode
A HIGH level on pin S selects Silent mode. In Silent mode the transmitter is disabled, releasing the bus pins to recessive state. All other IC functions, including the receiver, continue to operate as in Normal mode. Silent mode can be used to prevent a faulty CAN controller from disrupting all network communications.
6.2 Fail-safe features
6.2.1 TXD dominant time-out function
A `TXD dominant time-out' timer is started when pin TXD is set LOW. If the LOW state on pin TXD persists for longer than tto(dom)TXD, the transmitter is disabled, releasing the bus lines to recessive state. This function prevents a hardware and/or software application failure from driving the bus lines to a permanent dominant state (blocking all network communications). The TXD dominant time-out timer is reset when pin TXD is set HIGH. The TXD dominant time-out time also defines the minimum possible bit rate of 40 kbit/s.
6.2.2 Internal biasing of TXD and S input pins
Pin TXD has an internal pull-up to VIO and pin S has an internal pull-down to GND. This ensures a safe, defined state in case one or both of these pins are left floating.
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6.2.3 Undervoltage detection on pins VCC and VIO
Should VCC or VIO drop below their respective undervoltage detection levels (Vuvd(VCC) and Vuvd (VIO); see Table 6), the transceiver will switch off and disengage from the bus (zero load) until VCC and VIO have recovered.
6.2.4 Overtemperature protection
The output drivers are protected against overtemperature conditions. If the virtual junction temperature exceeds the shutdown junction temperature, Tj(sd), the output drivers will be disabled until the virtual junction temperature falls below Tj(sd) and TXD becomes recessive again. Including the TXD condition ensures that output driver oscillations due to temperature drift are avoided.
6.3 VIO supply pin
Pin VIO should be connected to the microcontroller supply voltage (see Figure 3). This adjusts the signal levels on pins TXD, RXD and S to the I/O levels of the microcontroller.
7. Application design-in information
BAT
3V
5V VCC CANH CANH S Pyy TX0 RX0 GND GND
015aaa101
VIO VDD
TJF1051
CANL
TXD RXD
MICROCONTROLLER
CANL
Fig 3.
Typical application of the TJF1051
8. Limiting values
Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND. Symbol Parameter Vx voltage on pin x Conditions no time limit; DC value on pins CANH and CANL on any other pin -58 -0.3 +58 +7 V V Min Max Unit
TJF1051
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Table 4. Limiting values ...continued In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND. Symbol Parameter VESD electrostatic discharge voltage Conditions HBM pins CANH and CANL any other pin MM any pin Tamb
[1] [2]
[2] [1]
Min -8 -4 -300 -40
Max +8 +4 +300 +85
Unit kV kV V C
ambient temperature
Human Body Model (HBM): 100 pF, 1.5 k. Machine Model (MM): 200 pF, 0.75 H, 10 .
9. Thermal characteristics
Table 5. Thermal characteristics According to IEC 60747-1. Symbol Rth(vj-a) Parameter thermal resistance from virtual junction to ambient Conditions in free air Value 155 Unit K/W
10. Static characteristics
Table 6. Static characteristics Tamb = -40 C to +85 C; VCC = 4.5 V to 5.5 V; RL = 60 ; unless otherwise specified; all voltages are defined with respect to ground; positive currents flow into the IC. Symbol VCC ICC Parameter supply voltage supply current Silent mode Normal mode recessive dominant; VTXD = 0 V Vuvd(VCC) undervoltage detection voltage on pin VCC supply voltage on pin VIO supply current on pin VIO Normal and Silent modes recessive; VTXD = VIO dominant; VTXD = 0 V Vuvd(VIO) undervoltage detection voltage on pin VIO HIGH-level input voltage LOW-level input voltage HIGH-level input current LOW-level input current VS = 0 V
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Conditions
Min 4.5 0.1 2.5 20 3.5
Typ 1 5 50 -
Max 5.5 2.5 10 70 4.5
Unit V mA mA mA V
Supply; pin VCC
I/O level adapter supply; pin VIO VIO IIO 2.8 10 50 1.3 80 350 5.5 250 500 2.7 V A A V
Mode control input; pin S VIH VIL IIH IIL
TJF1051
0.7VCC -0.3 1 -1
4 0
VCC + 0.3 V 0.3VCC 10 +1 V A A
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Product data sheet
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TJF1051
High-speed CAN transceiver
Table 6. Static characteristics ...continued Tamb = -40 C to +85 C; VCC = 4.5 V to 5.5 V; RL = 60 ; unless otherwise specified; all voltages are defined with respect to ground; positive currents flow into the IC. Symbol VIH VIL IIH IIL Ci IOH IOL VO(dom) Parameter HIGH-level input voltage LOW-level input voltage HIGH-level input current LOW-level input current input capacitance HIGH-level output current LOW-level output current dominant output voltage VRXD = VCC - 0.4 V VRXD = 0.4 V; bus dominant VTXD = 0 V; t < tto(dom)TXD pin CANH pin CANL Vdom(TX)sym transmitter dominant voltage symmetry VO(dif)bus VO(rec) Vth(RX)dif Vhys(RX)dif IO(dom) bus differential output voltage recessive output voltage differential receiver threshold voltage differential receiver hysteresis voltage dominant output current Vdom(TX)sym = VCC - VCANH - VCANL VTXD = 0 V; t < tto(dom)TXD VTXD = VIO; recessive; no load Normal and Silent modes; VTXD = VIO; no load Normal and Silent modes Vcm(CAN)[1] = -12 V to +12 V Normal and Silent modes Vcm(CAN) = -12 V to +12 V VTXD = 0 V; t < tto(dom)TXD; VCC = 5 V pin CANH; VCANH = 0 V pin CANL; VCANL = 5 V/40 V IO(rec) recessive output current Normal and Silent modes; VTXD = VCC; VCANH = VCANL = -27 V to +32 V VCC = 0 V; VCANH = VCANL = 5 V between VCANH and VCANL -120 40 -5 -70 70 -40 120 +5 mA mA mA 2.75 0.5 -400 1.5 -50 2 0.5 50 3.5 1.5 0 4.5 2.25 +400 3 +50 V V mV V mV V V mV VTXD = VCC Normal mode; VTXD = 0 V Conditions Min 0.7VCC -0.3 -5 -260 -8 2 Typ 0 -150 5 -3 5 Max Unit CAN transmit data input; pin TXD VCC + 0.3 V 0.3VCC +5 -30 10 -1 12 V A A pF mA mA
CAN receive data output; pin RXD
Bus lines; pins CANH and CANL
0.5VCC 3 0.7 120 0.9 400
IL Ri Ri Ri(dif) Ci(cm) Ci(dif) Tj(sd)
[1]
leakage current input resistance input resistance deviation differential input resistance common-mode input capacitance differential input capacitance shutdown junction temperature
-5 9 -3 19 -
0 15 0 30 190
+5 28 +3 52 20 10 -
A k % k pF pF C
Temperature protection
Vcm(CAN) is the common mode voltage of CANH and CANL.
TJF1051
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11. Dynamic characteristics
Table 7. Dynamic characteristics Tamb = -40 C to +85 C; VCC = 4.5 V to 5.5 V; RL = 60 unless specified otherwise. All voltages are defined with respect to ground. Positive currents flow into the IC. Symbol td(TXD-busdom) td(TXD-busrec) td(busrec-RXD) tPD(TXD-RXD) Parameter delay time from TXD to bus dominant delay time from TXD to bus recessive delay time from bus recessive to RXD propagation delay from TXD to RXD Conditions Normal mode Normal mode Normal and Silent modes Normal and Silent modes 2.8 V < VIO < 4.5 V Normal mode 4.5 V > VCC = VIO < 5.5 V Normal mode tto(dom)TXD TXD dominant time-out time VTXD = 0 V; Normal mode Min 40 40 0.3 Typ 65 90 60 65 1 Max 250 220 12 Unit ns ns ns ns ns ns ms Transceiver timing; pins CANH, CANL, TXD and RXD; see Figure 4 and Figure 5
td(busdom-RXD) delay time from bus dominant to RXD
+5 V
47 F 100 nF
VIO TXD
VCC CANH
TJF1051
RL
100 pF
RXD GND
15 pF
CANL S
015aaa103
Fig 4.
Timing test circuit for CAN transceiver
TJF1051
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High-speed CAN transceiver
HIGH TXD LOW CANH
CANL dominant 0.9 V
VO(dif)(bus) 0.5 V recessive HIGH RXD 0.7VIO 0.3VIO LOW td(TXD-busdom) td(TXD-busrec) td(busdom-RXD) tPD(TXD-RXD) tPD(TXD-RXD) td(busrec-RXD)
015aaa025
Fig 5.
CAN transceiver timing diagram
TJF1051
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High-speed CAN transceiver
12. Package outline
SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
D
E
A X
c
y
HE
vMA
Z
8 5
Q A2
pin 1 index
A1
(A 3) Lp L
A
1
4
e
bp
wM
detail X
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT96-1 REFERENCES IEC
076E03
A max. 1.75
0.069
A1 0.25 0.10
A2 1.45 1.25
A3 0.25
0.01
bp 0.49 0.36
c 0.25 0.19
D (1) 5.0 4.8
0.20 0.19
E (2) 4.0 3.8
0.16 0.15
e 1.27
0.05
HE 6.2 5.8
L 1.05
Lp 1.0 0.4
Q 0.7 0.6
v 0.25
0.01
w 0.25
0.01
y 0.1
0.004
Z (1) 0.7 0.3
0.028 0.012
o
0.010 0.057 0.004 0.049
0.019 0.0100 0.014 0.0075
0.244 0.039 0.028 0.041 0.228 0.016 0.024
8 o 0
JEDEC
MS-012
JEITA
EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-18
Fig 6.
TJF1051
Package outline SOT96-1 (SO8)
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13. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 "Surface mount reflow soldering description".
13.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization.
13.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following:
* Through-hole components * Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are:
* * * * * *
Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering
13.3 Wave soldering
Key characteristics in wave soldering are:
* Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are exposed to the wave
* Solder bath specifications, including temperature and impurities
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13.4 Reflow soldering
Key characteristics in reflow soldering are:
* Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 7) than a SnPb process, thus reducing the process window
* Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
* Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 8 and 9
Table 8. SnPb eutectic process (from J-STD-020C) Package reflow temperature (C) Volume (mm3) < 350 < 2.5 2.5 Table 9. 235 220 Lead-free process (from J-STD-020C) Package reflow temperature (C) Volume (mm3) < 350 < 1.6 1.6 to 2.5 > 2.5 260 260 250 350 to 2000 260 250 245 > 2000 260 245 245 350 220 220
Package thickness (mm)
Package thickness (mm)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 7.
TJF1051
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temperature
maximum peak temperature = MSL limit, damage level
minimum peak temperature = minimum soldering temperature
peak temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 7.
Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365 "Surface mount reflow soldering description".
14. Revision history
Table 10. Revision history Release date 20100810 Data sheet status Product data sheet Change notice Supersedes Document ID TJF1051 v.1
TJF1051
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15. Legal information 16. Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
16.1 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification -- The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.
Suitability for use in automotive applications -- This NXP Semiconductors product has been qualified for use in automotive applications. The product is not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer's sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer's applications and products planned, as well as for the planned application and use of customer's third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer's applications or products, or the application or use by customer's third party customer(s). Customer is responsible for doing all necessary testing for the customer's applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer's third party customer(s). NXP does not accept any liability in this respect. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer's general terms and conditions with regard to the purchase of NXP Semiconductors products by customer.
16.2 Disclaimers
Limited warranty and liability -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors' aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.
TJF1051
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No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.
16.3 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
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High-speed CAN transceiver
18. Contents
1 2 2.1 2.2 2.3 3 4 5 5.1 5.2 6 6.1 6.1.1 6.1.2 6.2 6.2.1 6.2.2 6.2.3 6.2.4 6.3 7 8 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 16 16.1 16.2 16.3 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Low-power management . . . . . . . . . . . . . . . . . 1 Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Operating modes . . . . . . . . . . . . . . . . . . . . . . . 4 Normal mode . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Silent mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Fail-safe features . . . . . . . . . . . . . . . . . . . . . . . 4 TXD dominant time-out function . . . . . . . . . . . . 4 Internal biasing of TXD and S input pins . . . . . 4 Undervoltage detection on pins VCC and VIO . . 5 Overtemperature protection . . . . . . . . . . . . . . . 5 VIO supply pin . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Application design-in information . . . . . . . . . . 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 Thermal characteristics . . . . . . . . . . . . . . . . . . 6 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6 Dynamic characteristics . . . . . . . . . . . . . . . . . . 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Soldering of SMD packages . . . . . . . . . . . . . . 11 Introduction to soldering . . . . . . . . . . . . . . . . . 11 Wave and reflow soldering . . . . . . . . . . . . . . . 11 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 11 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 14 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Contact information. . . . . . . . . . . . . . . . . . . . . 15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 10 August 2010 Document identifier: TJF1051

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